· Package Assembly and Failure Analysis support related services

· Prototype IC Packaging, Stacked-die packaging, Hybrid MCM module packaging (Laminate/Ceramic)

· Repackaging of chip scale, stacked-die, bare die, flip chips, obsolete die, etc. for FA / Qaulification / Engineering Evaluation requirements.

· BGA Reball/Rework; TBGA, GBGA, cdBGA, csBGA, uBGA, nBGA

BGA

· Scanning Acoustic Microscopy ( SAM, C-SAM)

SAM, C-SAM

· X-Ray, High Magnification, High Resolution

SAM, C-SAM

· Chemical and Mechanical Deprocessing / Decapsulation

 

· FA, Reject and Qualification Die recovery

· Laser etching, ablating and marking

· Cross-sectioning (X-Sectioning)

X-Section

· Reliability Testing and technical support related services

                  Preconditioning, Dry Bake

                  Temperature and Humidity 80/85 test chamber

                  Temperature Cycle Testing

                  Thermal Shock Testing

                  Autoclave, High Termperature, 100% RH

                  High Temp Storage Life